Defect detection and image comparison of components in an assembly

ABSTRACT

A method is disclosed that includes receiving, by a processing device, a plurality of images of a test assembly. The processing device selects a component in the test assembly and an image of the plurality of images of the test assembly as received. For the component as selected and the image as selected, the processing device compares a plurality of portions of the image as selected to a corresponding plurality of portions of a corresponding profile image and computing a matching score for each of the plurality of portions. The processing device selects a largest matching score from the matching score for each of the plurality of portions as a first matching score for the component as selected and the image as selected. The first matching score is stored for the component as selected and the image as selected.

FIELD OF THE TECHNOLOGY

At least some embodiments disclosed herein relate generally to componentinstallation validation. More particularly, the embodiments relate toartificial intelligence systems and methods for computer-aidedvalidation of the installation of a component in an assembly such as acomputing device.

BACKGROUND

Device manufacturing, such as mobile devices (e.g., smartphones,tablets, smartwatches, or the like) utilize several components assembledtogether. The assembly process can include, for example, securing thecomponents together via fasteners (e.g., screws or the like). Theassembly process, if not completed properly (e.g., missing screws,incorrect screws, improperly tightened screws, or the like), can causequality control issues.

Improved methods and systems for validating the proper installation ofthe various components are desirable.

BRIEF DESCRIPTION OF THE DRAWINGS

References are made to the accompanying drawings that form a part ofthis disclosure and illustrate embodiments in which the systems andmethods described in this Specification can be practiced.

References are made to the accompanying drawings that form a part ofthis disclosure and illustrate embodiments in which the systems andmethods described in this Specification can be practiced.

FIG. 1 shows a system for validation of installation of a component inan assembly, according to an embodiment.

FIG. 2 shows a portion of the system for validation of installation of acomponent of an assembly of FIG. 1 , according to an embodiment.

FIG. 3 shows a schematic architecture for the system of FIG. 1 ,according to an embodiment.

FIG. 4 shows a flowchart for a method of validating installation of acomponent in an assembly using artificial intelligence, according to anembodiment.

FIG. 5 shows a first graphical user interface (GUI), according to anembodiment.

FIG. 6 shows a second GUI, according to an embodiment.

FIG. 7 shows a third GUI, according to an embodiment.

FIG. 8 shows a flowchart for a method 400 for comparing components inimages of a test assembly with components in images of a profileassembly, according to an embodiment.

Like reference numbers represent like parts throughout.

DETAILED DESCRIPTION

Computing devices such as, but not limited to, smartphones, tablets,laptops, smartwatches, and the like, include numerous components thatare assembled together. The assembly process can include fasteners(e.g., screws or the like) that keep the various components secured. Itis important that these fasteners be installed correctly (e.g., allscrews installed (e.g., no missing screws), proper screws installed,screws properly tightened, or the like) as part of the quality controlprocess.

The embodiments disclosed herein are directed to a system and method forinspecting components (e.g., fasteners such as screws or the like) of anassembly (e.g., a computing device such as, but not limited to, asmartphone, a tablet, a laptop, a smartwatch, a cellphone, or the like)during the manufacturing process. The system includes a platform thatholds the test assembly (i.e., the assembly being inspected) in adefined position. The defined position is established relative to aplurality of cameras that are arranged to capture different views of theassembly.

When an assembly (e.g., a computing device) is placed onto the platform,an image of the assembly is captured from each of the plurality ofcameras. The plurality of cameras are triggered to capture each of theimages at the different viewing angles in response to a combination ofproximity and motion sensors that identify when the assembly is inplace. “Profile images” (i.e., images of a model assembly (e.g., a modelassembly (i.e., screws properly installed)) can be captured in acalibration process. The platform maintains the assembly in a generallyfixed location. As a result, each image of an assembly being validated(i.e., a test assembly) is taken in the same coordinate system or with apredetermined relationship maintained by the platform relative to thecorresponding profile image.

Each of the captured images is compared against the correspondingprofile image to determine a matching score representative of whetherthe components were correctly installed.

In an embodiment, the different viewing angles can provide a moreaccurate response, as the installation defect may be noticeable in oneof the views but appear correct (or not be noticeable) in another of theviews. The matching score is based on the comparison of each view. Inresponse to the determination, an indicator (correct, incorrect,requires further checking) including one of the profile images is thendisplayed on an interface of the system.

A method includes receiving, by a processing device, a plurality ofimages of a test assembly. The processing device selects a component inthe test assembly and an image of the plurality of images of the testassembly as received. For the component as selected and the image asselected, the processing device compares a plurality of portions of theimage as selected to a corresponding plurality of portions of acorresponding profile image and computing a matching score for each ofthe plurality of portions. The processing device selects a largestmatching score from the matching score for each of the plurality ofportions as a first matching score for the component as selected and theimage as selected. The first matching score is stored for the componentas selected and the image as selected.

A system includes a processing device configured to receive a pluralityof images of a test assembly. The processing device selects a componentin the test assembly and an image of the plurality of images of the testassembly as received. For the component as selected and the image asselected, the processing device compares a plurality of portions of theimage as selected to a corresponding plurality of portions of acorresponding profile image and computing a matching score for each ofthe plurality of portions. A largest matching score is selected from thematching score for each of the plurality of portions as a componentmatching score for the component as selected and the image as selected.The component matching score is stored for the component as selected andthe image as selected.

A method is disclosed including capturing a plurality of images using aplurality of cameras, wherein the plurality of cameras are oriented tocapture a different view of a test assembly including a plurality ofcomponents. The processing device selects a component in the testassembly and an image of the plurality of images of the test assembly asreceived. For the component as selected and the image as selected, theprocessing device compares a plurality of portions of the image asselected to a corresponding plurality of portions of a correspondingprofile image and computes a matching score for each of the plurality ofportions. The processing device selects a largest matching score fromthe matching score for each of the plurality of portions as a firstmatching score for the component as selected and the image as selected.An indication is generated of whether the component was correctlyinstalled in the test assembly based on the component matching score.

FIG. 1 shows a system 10 for validation of installation of a componentin an assembly 15, according to an embodiment. The system 10 cangenerally be used to, for example, validate whether a fastener (e.g., ascrew or the like) or other component is properly installed in theassembly 15. In an embodiment, the validation can be part of a qualitycontrol process during manufacturing. In an embodiment, the system 10can be used to validate whether the fastener or other component isproperly installed at a point after manufacturing (e.g., duringrefabricating, maintenance, or the like).

In the illustrated embodiment, the assembly 15 is a smartphone. It is tobe appreciated that the smartphone is an example, and the assembly 15can vary beyond a smartphone. Examples of other assemblies 15 include,but are not limited to, a tablet, a smartwatch, a mobile phone otherthan a smartphone, a personal digital assistant (PDA), a laptopcomputing device, or the like. Furthermore, the maker or manufacturer ofthe assembly 15 is not limited. That is, the system 10 can be used tovalidate the installation correctness of components in assemblies 15from different manufacturers so long as a calibration procedure isperformed to create a profile image for the corresponding assembly 15.

The system 10 includes a display 20 for displaying results of thevalidation to the user. In an embodiment, the display 20 can be acombined display and input (e.g., a touchscreen). In an embodiment, thedisplay 20 can be a display of a tablet or the like. In such anembodiment, a memory of the tablet can store one or more programs to beexecuted by a processing device of the tablet for validating thecorrectness of the installation of the component in the assembly 15.

In the illustrated embodiment, the display 20 is secured to housing 25of the system 10. In an embodiment, the display 20 can be separate fromthe housing 25 (i.e., not secured to the housing 25, but positioned nearthe system 10 and electronically connected to the system 10). However,it may be beneficial to secure the display 20 to the housing 25 toreduce a footprint of the system 10.

A platform 30 is utilized to position the assembly 15 within the system10 for validation. The platform 30 enables each assembly 15 placed intothe system 10 for validation to be placed in substantially the samelocation. As a result, an amount of effort in determining whether theprofile image and the assembly 15 under test (test assembly) is in asame location relative to cameras of the system 10 can be reduced. Theplatform 30 is shown and described in additional detail in accordancewith FIG. 2 below.

In an embodiment, the system 10 can be portable. For example, theillustrated embodiment shows system 10 with a handle 35 for carrying thesystem 10. It is to be appreciated that portability of the system 10 isoptional, and accordingly, the handle 35 is optional. In an embodiment,the system 10 may be sized differently based on the type of assembly 15to be validated.

FIG. 2 shows the platform 30 of the system 10 of FIG. 1 for validationof installation of a component in an assembly 15, according to anembodiment.

The platform 30 includes a tiered surface having a first surface 40 anda second surface 45. A step is thus formed between the first surface 40and the second surface 45. A plane of the first surface 40 and a planeof the second surface 45 are parallel. In the illustrated embodiment,the second surface 40 is L-shaped when viewed from a top view.

The second surface 45 is positioned a height H from the first surface40. The height H between the first surface 40 and the second surface 45creates an abutment surface 50.

The height H is selected such that the abutment surface 50 serves as astop for the assembly 15 when placed within the system 10. The abutmentsurface 50 is configured to provide a stop for the assembly 15 on twosides of the assembly 15 (i.e., a major dimension of the assembly 15 anda minor dimension of the assembly 15).

The height H is selected to be smaller than a thickness T of theassembly 15 being validated in the system 10. The height H is selectedto be smaller than the thickness T of the assembly 15 to not hinder sideviews of the assembly 15. The height H is selected to be large enoughthat an operator inserting the assembly 15 can abut the assembly 15 withthe abutment surface 50. In this manner, the abutment surface 50 servesas a stop for the operator when inserting the assembly 15 into thesystem 10. In an embodiment, the height H can be substantially the sameas the thickness T of the assembly 15.

The configuration of the platform 30 is helpful in establishing thelocation of the assembly 15. By including the platform 30, the system 10can be calibrated to generate the profile images using a single assemblysince the coordinate system is generally fixed. The platform 30 can, asa result, be used to account for minor variations in placement of theassembly 15 by the operator as the offset from the expected coordinatedsystem can be determined based on the location of the assembly 15relative to a calibration assembly 15.

FIG. 3 shows a schematic architecture for the system 10 of FIG. 1 ,according to an embodiment.

The system 10 generally includes a plurality of cameras 100; a motionsensor 105; a proximity sensor 110; a processing device 115, memory 120,a network input/output (I/O) 125, user I/O 130, storage 135, and aninterconnect 140. The processing device 115, memory 120, networkinput/output (I/O) 125, user I/O 130, storage 135, and interconnect 140can be within the housing 25 in an embodiment. In an embodiment, theprocessing device 115, memory 120, network input/output (I/O) 125, userI/O 130, storage 135, and interconnect 140 can be external from thehousing 25.

The plurality of cameras 100 are arranged in the system 10 to capturedifferent views of the assembly 15. In an embodiment, the cameras 100are digital cameras. For example, in an embodiment the system 10includes three cameras 100 arranged to capture a top view, an up-frontview, and an up-side view. In an embodiment, the system 10 includes fourcameras 100 arranged to capture a top view, an up-front view, a firstup-side view, and a second (opposite) up-side view. It will beappreciated that a single camera 100 could be used, although accuracymay be improved when a plurality of cameras 100 are used as a componentmay appear to be correctly installed in a first view but be determinedto be incorrectly installed in a second view.

The motion sensor 105 can be, for example, a laser sensor that can betriggered when an object (i.e., assembly 15) breaks the laser signal.The motion sensor 105 can be installed at the opening to the housing 25.In an embodiment, the motion sensor 105 may not be included.

The proximity sensor 110 can be a sensor to determine when an object isplaced near it. The proximity sensor 110 can be placed in the platform30 of the system 10. In an embodiment, when the motion sensor 105 istriggered and the proximity sensor 110 detects an object, the cameras100 can capture images of the assembly 15 on the platform 30. In anembodiment, the proximity sensor 110 can be included regardless ofwhether the motion sensor 105 is present. In an embodiment with bothmotion sensor 105 and proximity sensor 110, the image capturing may beperformed after the proximity sensor 110 detects the assembly 15.

In an embodiment, automatically causing the image capturing andsubsequent validation to be performed using the proximity sensor 110, ora combination of the proximity sensor 110 and the motion sensor 105, canincrease a number of assemblies 15 that can be validated in a setperiod. That is, reducing effort of a human operator, or even allowingfor a robotic arm to load the assembly 15 into the system 10 forvalidation, can reduce an amount of time and effort needed to review thequality of the manufacturing process.

The processing device 115 can retrieve and execute programminginstructions stored in the memory 120, the storage 135, or combinationsthereof. The processing device 115 can also store and retrieveapplication data residing in the memory 120. The programminginstructions can perform the method described in accordance with FIG. 4below to determine whether the components of the assembly 15 areproperly installed, and additionally, cause display of one of thegraphical user interfaces (GUIs) shown and described in accordance withFIGS. 5-7 below.

The interconnect 140 is used to transmit programming instructions and/orapplication data between the processing device 115, the user I/O 130,the memory 120, the storage 135, and the network I/O 125. Theinterconnect 140 can, for example, be one or more busses or the like.The processing device 115 can be a single processing device, multipleprocessing devices, or a single processing device having multipleprocessing cores. In an embodiment, the processing device 115 can be asingle-threaded processing device. In an embodiment, the processingdevice 115 can be a multi-threaded processing device.

The memory 120 is generally included to be representative of arandom-access memory such as, but not limited to, Static Random-AccessMemory (SRAM), Dynamic Random-Access Memory (DRAM), or Flash. In anembodiment, the memory 120 can be a volatile memory. In an embodiment,the memory 120 can be a non-volatile memory. In an embodiment, at leasta portion of the memory 120 can be virtual memory.

The storage 135 is generally included to be representative of anon-volatile memory such as, but not limited to, a hard disk drive, asolid-state device, removable memory cards, optical storage, flashmemory devices, network attached storage (NAS), or connections tostorage area network (SAN) devices, or other similar devices that maystore non-volatile data. In an embodiment, the storage 135 is a computerreadable medium. In an embodiment, the storage 135 can include storagethat is external to the user device, such as in a cloud.

FIG. 4 shows a flowchart for a method 200 of validating installation ofa component in an assembly 15 using artificial intelligence, accordingto an embodiment.

At block 205 a test assembly 15 is loaded into the system 10. Thisincludes abutting the assembly 15 with the abutment surface 50 of theplatform 30. In an embodiment, the assembly 15 can be loaded by a humanoperator. In an embodiment, a robotic or mechanical arm can be automatedto place the assembly 15 onto the platform 30. The placement of theassembly 15 can cause the motion sensor 105, the proximity sensor 110,or a combination thereof, to generate a signal indicative of the testassembly 15 being in place.

At block 210, in response to the signal generated by the motion sensor105, the proximity sensor 110, or a combination thereof, the pluralityof cameras 100 each capture an image. As discussed above, the cameras100 are oriented such that the captured images are of different views ofthe assembly 15.

At block 215, each component within each of the captured images iscompared against the corresponding component in the correspondingprofile image. The comparison methodology is discussed in more detail inaccordance with FIG. 8 below.

At block 220 an output is generated indicative of the results of thevalidation (e.g., correct, incorrect, needs checking). The output can bebased on a range of the matching score. That is, if the matching scoreis greater than a first value, then the output can be that theinstallation is correct; between the first value and a lower secondvalue, the installation may need checking; and between the lower secondvalue and a third value that is lower than the second value, theinstallation may be incorrect.

At block 225, the output is displayed on the display 20 of the system10. In an embodiment, the display can include a notation of whichcomponents are incorrect or need checking. In an embodiment, to reduceprocessing effort and increase a speed of the output, the display caninclude one of the profile images (instead of one of the captured imagesfor the assembly 15 being tested).

FIG. 5 shows a first graphical user interface (GUI) 250, according to anembodiment. The first GUI 250 is generally representative of a GUIdisplayed when the manufacturing component was validated and determinedto be correctly installed.

FIG. 6 shows a second GUI 300, according to an embodiment. The secondGUI 300 is generally representative of a GUI displayed when themanufacturing component was incorrectly installed.

FIG. 7 shows a third GUI 350, according to an embodiment. The third GUI350 is generally representative of a GUI displayed when themanufacturing component was determined to have a potential issue, or anappropriate confidence factor was not met.

The GUIs 250-350 in FIGS. 5-7 generally include an indicator 255. In theGUIs 300 and 350, because the GUIs are representative of situationswhere the installation of the component was not validated as beingcorrect, a profile image 260 is displayed showing the correct assembly.It is to be appreciated that the GUI 250 could also display the profileimage 260. The indicator 255 can vary based on the GUI to visuallyrepresent to the operator whether the component was correctly installed(GUI 250), incorrectly installed (GUI 300), or needs checking (GUI 350).The indicators 255 in the illustrated embodiments are representative andare not intended to be limiting. The image 260 in each of the GUIs 300and 350 is the same and is a top view of the profile image. It is to beappreciated that the image 260 can vary. That is, a different view canbe shown in an embodiment.

FIG. 8 shows a flowchart for a method 400 for comparing components inimages of a test assembly with components in images of a profileassembly, according to an embodiment. As discussed above, the method 400can be performed at block 215 of the method 200 (FIG. 3 ). The method400 generally receives as input, a plurality of images of a testassembly 15 and performs a comparison using artificial intelligence todetermine a matching score for components of the test assembly ascaptured in the test images relative to the profile images.

At block 405, the processing device (e.g., the processing device 115 inFIG. 3 ) receives a plurality of images of a test assembly (e.g., theassembly 15 shown in FIGS. 1 and 2 ). The plurality of images of thetest assembly 15 correspond to a plurality of profile images captured ofa profile assembly during a calibration of the system 10. That is, theplurality of profile images are captured of the same views as theplurality of images of the test assembly 15. The profile assembly is thesame type of device as the test assembly 15 and includes correctinstallation of the components (e.g., screws or the like) beingvalidated. The plurality of profile images can be stored in the storage135 of the system 10.

At block 410, the processing device 115 selects an image from theplurality of images as received for validation of the test assembly 15.

At block 415, the processing device selects a component in the testassembly 15.

At block 420, for the selected component and selected image, theprocessing device 115 compares a portion of the selected image to aportion of the corresponding profile image and computes a matchingscore. In an embodiment, the matching score can be computed using asimilarity metric such as, but not limited to, correlation coefficientscore. For example, if a center of the component is a point (x, y) inthe profile image, the portion would be at (x, y).

At block 425, the processing device 115 can check whether a thresholdnumber of portions of the received image and the corresponding profileimage have been compared. The threshold number can be selected tobalance a computing effort and an accuracy of the comparison. In anembodiment, the threshold can be selected to be from 50-500. Thethreshold can be selected to compare enough portions of the images tocompensate for minor displacements (e.g., 0-20 pixels or 1-2 mm inphysical space) of the component in the test images relative to thecomponent in the profile images.

If at block 425, the threshold has not been met, at block 430 anotherportion of the received image is compared to another portion of thecorresponding profile image. Thus, additional points around (x, y) canbe compared to provide a higher accuracy in making the validation. Thisimprovement in accuracy can, for example, be because the multiplesamples can compensate for minor displacements (e.g., 0-20 pixels or 1-2mm in physical space) of the components being tested relative to thecomponents in the profile image. Thus, the sampling of these portionscan account for minor variations in the placement of the assembly 15 atblock 205 (FIG. 2 ).

If at block 425, the threshold number of portions has been compared, atblock 435, the processing device 115 selects the largest matching scorefrom the set of matching scores for the portions of the received imageto be the matching score for the selected component in the selectedimage. It is to be appreciated that other statistical values could beused for the matching score, such as, but not limited to, the mean,median, or mode.

At block 440, the processing device 115 determines whether more imageshave been received at block 405 than have been the selected image atblock 410. If there are more images, the method 400 continues to block445, and the processing device selects another image then completesblocks 420-435 for the selected image.

If there are no more images at block 440, the method 400 continues toblock 450, and the processing device selects a smallest matching scorefrom the images for the selected component. It is to be appreciated thatother statistical values could be used for the matching score, such as,but not limited to, the mean, median, or mode. By selecting the smallestmatching score, the method 400 can identify situations in which thecomponent appears to be correctly installed in one image, but is notcorrectly installed, as identified in another of the images.

In performing the similarity comparison, several bases for determining acomponent is incorrect can be captured. For example, the validation canidentify missing components, improperly installed components (e.g.,wrong screw or the like), or installations that are not complete (e.g.,a screw is not tightened or is over-tightened) based on orientation ofthe component. It is to be appreciated that the matching score will beimpacted more heavily by a missing or incorrect component than by amisoriented component. The highest matching score for each component iscompared across the plurality of images to determine which is relativelysmallest. The smallest of the matching scores across the plurality ofimages is retained as the matching score for that component.

After block 450, the method 400 is complete (and accordingly, block 215)of the method 200 in FIG. 2 .

Examples of computer-readable storage media include, but are not limitedto, any tangible medium capable of storing a computer program for use bya programmable processing device to perform functions described hereinby operating on input data and generating an output. A computer programis a set of instructions that can be used, directly or indirectly, in acomputer system to perform a certain function or determine a certainresult. Examples of computer-readable storage media include, but are notlimited to, a floppy disk; a hard disk; a random access memory (RAM); aread-only memory (ROM); a semiconductor memory device such as, but notlimited to, an erasable programmable read-only memory (EPROM), anelectrically erasable programmable read-only memory (EEPROM), Flashmemory, or the like; a portable compact disk read-only memory (CD-ROM);an optical storage device; a magnetic storage device; other similardevice; or suitable combinations of the foregoing.

In some embodiments, hardwired circuitry may be used in combination withsoftware instructions. Thus, the description is not limited to anyspecific combination of hardware circuitry and software instructions,nor to any source for the instructions executed by the data processingsystem.

The terminology used herein is intended to describe embodiments and isnot intended to be limiting. The terms “a,” “an,” and “the” include theplural forms as well, unless clearly indicated otherwise. The terms“comprises” and/or “comprising,” when used in this Specification,specify the presence of the stated features, integers, operations,elements, and/or components, but do not preclude the presence oraddition of one or more other features, integers, operations, elements,and/or components.

It is to be understood that changes may be made in detail, especially inmatters of the construction materials employed and the shape, size, andarrangement of parts without departing from the scope of the presentdisclosure. This Specification and the embodiments described areexamples, with the true scope and spirit of the disclosure beingindicated by the claims that follow.

What is claimed is:
 1. A method, comprising: receiving, by a processingdevice, a plurality of images of a test assembly; selecting, by theprocessing device, a component in the test assembly and an image of theplurality of images of the test assembly as received; for the componentas selected and the image as selected, comparing, by the processingdevice, a plurality of portions of the image as selected to acorresponding plurality of portions of a corresponding profile image andcomputing a set of matching scores for the plurality of portions;selecting, by the processing device, a largest matching score from theset of matching scores to be a first matching score for the component asselected and the image as selected; and storing the first matching scorefor the component as selected and the image as selected.
 2. The methodof claim 1, comprising selecting another image of the plurality ofimages of the test assembly as received; for the component as selectedand the another image as selected, comparing a plurality of portions ofthe another image as selected to a corresponding plurality of portionsof a corresponding profile image and computing another set of matchingscores for the plurality of portions; selecting a largest matching scorefrom the another set of matching scores for the plurality of portions tobe a second matching score for the component as selected and the anotherimage as selected; and storing the second matching score for thecomponent as selected and the another image as selected.
 3. The methodof claim 2, comprising comparing the first matching score for thecomponent as selected in the image as selected with the second matchingscore for the component as selected in the another image as selected;and storing a smaller of the first and second matching scores to be athird matching score.
 4. The method of claim 3, wherein the thirdmatching score is used to determine whether the component was correctlyinstalled.
 5. The method of claim 4, comprising generating an indicationof whether the component was correctly installed in the test assemblybased on the third matching score.
 6. The method of claim 1, wherein anumber of the plurality of portions is selected to account for minorvariations in placement of the test assembly relative to the profileassembly.
 7. The method of claim 1, wherein the plurality of images ofthe test assembly as received each have a different view of the testassembly.
 8. The method of claim 1, wherein the component is a screw andthe test assembly is a smartphone.
 9. The method of claim 1, wherein theplurality of images of the test assembly as received include the sameviews as the plurality of profile images.
 10. The method of claim 1,wherein the plurality of images includes three images, the three imagesincluding a top view, an up-front view, and an up-side view.
 11. Asystem, comprising: a processing device configured to: receive aplurality of images of a test assembly; select a component in the testassembly and an image of the plurality of images of the test assembly asreceived; for the component as selected and the image as selected,compare a plurality of portions of the image as selected to acorresponding plurality of portions of a corresponding profile image andcomputing a set of matching scores for the plurality of portions; selecta largest matching score from the set of matching scores to be acomponent matching score for the component as selected and the image asselected; and store the component matching score for the component asselected and the image as selected.
 12. The system of claim 11,comprising a plurality of cameras oriented to capture different views ofthe test assembly.
 13. The system of claim 11, wherein the component isa screw and the test assembly is a smartphone.
 14. The system of claim11, comprising a housing enclosing a platform comprising an abutmentsurface configured to fix a location of the test assembly.
 15. Thesystem of claim 11, wherein the processing device is further configuredto generate an indication of whether the component was correctlyinstalled in the test assembly based on the component matching score.16. The system of claim 15, comprising a display device configured todisplay a graphical user interface based on the indication as generated.17. A method, comprising: capturing a plurality of images using aplurality of cameras, wherein the plurality of cameras are oriented tocapture a different view of a test assembly including a plurality ofcomponents; selecting, by the processing device, a component in the testassembly and an image of the plurality of images of the test assembly asreceived; for the component as selected and the image as selected,comparing, by the processing device, a plurality of portions of theimage as selected to a corresponding plurality of portions of acorresponding profile image and computing a set of matching scores forthe plurality of portions; selecting, by the processing device, alargest matching score from the set of matching scores to be a firstmatching score for the component as selected and the image as selected;and generating an indication of whether the component was correctlyinstalled in the test assembly based on the first matching score. 18.The method of claim 17, comprising selecting another image of theplurality of images of the test assembly as received; for the componentas selected and the another image as selected, comparing a plurality ofportions of the another image as selected to a corresponding pluralityof portions of a corresponding profile image and computing another setof matching scores for the plurality of portions; and selecting alargest matching score from the another set of matching to be a secondmatching score for the component as selected and the another image asselected.
 19. The method of claim 17, wherein the component is a screwand the test assembly is one of a smartphone, a laptop, a cellularphone, a smartwatch, or a tablet.
 20. The method of claim 17, whereinthe plurality of images includes three images, the three imagesincluding a top view, an up-front view, and an up-side view.